ER&D · JDM · ODM · IOTA PaaS

Metal to cloud, under one roof.

The product engineering partner for hardware-led companies. From schematic to certified device. From pilot line to deployed fleet. One accountable team across electronics, firmware, industrial design, mechanical, compliance, and supply.

Concept

How we work

MODEL

Single accountable owner across electronics, firmware, industrial design, mechanical, testing, compliance, and pilot supply.

DEPTH

Real-world sensing, spatial intelligence, precision motion, wireless networks, IoT cloud, and the human–machine interface layered on top.

OUTPUT

Products that are finished, certified, connected, and manufacturable at pilot through to commercial scale.

ER&D Capability Stack

Eleven engineering disciplines, one workbench.

Six embedded blocks for what runs on the device; five realisation blocks for how it gets made. Every program draws from the same stack, in different combinations.

01

Embedded Blocks

  • ULP

    Ultra-Low Power

    BMS architectures and energy-budget engineering for primary-cell and rechargeable devices.

  • RF

    Custom RF & Wireless

    Spectrum-aware design across short-, mid- and long-range networks. Multi-protocol coexistence; pre-compliance through wireless certification. Counter-RF systems design.

  • IOT

    IoT Device & Cloud Infra

    One stack from boot ROM to fleet dashboard. Provisioning, telemetry, OTA, and remote ops as one engineered system.

  • MOT

    Motion Control

    Closed-loop actuation for ground, aerial and tabletop platforms. Drivetrains, gimbals, precision stages, and the safety harness.

  • SEN

    Sensing & Spatial

    Real-world signal capture and scene understanding — single-point sensors to multi-sensor spatial systems and the perception stack they feed.

  • ML

    ML & Edge Intelligence

    Perception, control and reinforcement pipelines that run on-device, edge or cloud. Production integration, not a notebook demo.

02

Realisation Blocks

  • RP

    Rapid Prototyping

    Engineering thermoplastics, high-res photopolymer fabrication, composite parts; in-house sheet metal for aluminium and steel.

  • EE

    Electronics Workbench

    Schematic, layout, signal integrity, power distribution, EMI/EMC pre-compliance, board bring-up — under one workbench.

  • OPT

    Optical & Precision Motion

    Camera-pipeline integration, calibrated optical assemblies, and sub-millimetre motion subsystems for industrial and broadcast use.

  • MFG

    In-house Manufacturing

    Premium end-to-end facility, 5,000 sq ft, Whitefield. SKD / CKD / FBU supply at pilot through commercial scale.

  • SCM

    Supply-Chain Engineering

    East/West dual-redundant component sourcing, BOM forensics, cost-curve modelling, dual-source design, Make-in-India value-add — owned at the design stage.

How we engage

Plug in at the phase that fits the brief.

A stage-gated lifecycle that flexes across consumer, medical, industrial, robotics, broadcast, and regulated infrastructure programs.

Phase

Concept & Design Validation

Role · ER&D

Output

Locked architecture, costed bill-of-materials, working engineering sample.

Engagement

Front-loaded for green-field programs; mid-stage entry for re-platforms.

Value-added services

On-top capabilities a contract design house cannot offer.

LC-SoM

Cut 12–16 weeks off the device critical path.

A pre-validated IoT compute and connectivity module with SDK and reference firmware. Programs start at architecture, not at bring-up.

Programs in flight

  • Toy SKU · BLE + IMU + audio
  • Industrial sensor · LoRa uplink
  • Wearable · UWB + 9-axis fusion
  • Smart appliance · BLE + Wi-Fi 6
  • Hand-held instrument · USB-C PD
  • Edge gateway · BLE/Thread + 4G

IOTA PaaS

The fleet your OEM doesn't have a cloud team for.

Provisioning, telemetry, OTA, user and operator dashboards — delivered as a managed service directly to the deployed fleet, independent of the OEM's cloud team.

Fleet telemetry

OTA · provisioning · ops

Compliance

Certification closure, by design.

BIS, EMI/EMC, WPC, RoHS, EN71, child-data privacy, ISO 13485-ready quality, CE / FCC / CPC export-market closure — planned at the architecture stage, not after the bench.

Standards in scope

  • BIS · IS 13252-1
  • WPC · ETA-2019/865 MHz
  • FCC · 47 CFR Part 15.247
  • RoHS · EU 2015/863
  • EN71-1/-2/-3 (toys)
  • ISO 13485 quality system

Start a program at the phase that fits the brief.

Concept · prototype · pilot · fleet. We plug in where the brief needs us, and stay accountable through the next gate.

sid@lightcon.es·Whitefield, Bengaluru